Consumer Electronics

Consumer electronics encompasses a wide range of products: smartphones, game consoles, flat-screen TVs, stereos, portable music players, cameras, e-readers and portable telecommunication devices, among many others. Product engineers in this industry must meet the high demand for innovation in both product aesthetic design and functionality. Limitations include reduced power consumption, miniaturization and weight reduction. And in general, the consumer electronics industry is highly competitive with a very short design cycle.

Laptop electromagnetic interference

To give a product design its best chance for success, engineering and design teams must accurately predict how complex components will behave in a real-world environment — one that changes continuously and involves the interaction of multiple types of physics. Only multiphysics simulation tools allows users to create virtual prototypes of their designs operating under such real-world conditions, predicting the interactions between structural mechanics, heat transfer, fluid flow and electromagnetics. Furthermore, the best simulation processes go beyond solving problems to developing innovative solutions.

ANSYS provides technology with unparalleled depth and breadth to help organizations shorten the design cycle as well as reduce costs, design uncertainty and the need for extensive testing. The simulation tools are integrated across a wide array of physics.

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Mechanical

On the mechanical front, how do shock and vibration loads, for example, affect a component’s reliability? ANSYS Mechanical software investigates linear and nonlinear mechanical behaviors including thermomechanical stress, modal, harmonic, and fatigue and vibration analysis. For explicit simulation, ANSYS Explicit STR technology offers shock and drop test simulation capabilities integrated with ANSYS Mechanical through the simulation platform, ANSYS Workbench. Simulation tools also address component- and board-level functions as well as modal, harmonic and vibration analysis.

Modal analysis of cell phone using ANSYS Mechanical

Thermal Management

More and more, consumer electronics devices contain powerful electronic components, crammed into tighter-than-ever-before spaces, that must not be allowed to overheat. ANSYS Icepak software enables system-level CFD simulation, including radiation, conduction, and natural and forced convection air cooling for a variety of complex geometries. Joule heating loads in package and PCB substrates can be performed in ANSYS SI/PI products and incorporated into the thermal design analysis.

Thermal management of cell phone using ANSYS Icepak

Electromagnetic

ANSYS offer solutions for high-speed channel design as well as wireless and antenna design.

In high-speed channel design, HFSS, SIwave and DesignerSI offer comprehensive electromagnetic and circuit simulation tools for signal and power integrity as well electromagnetic interference and compatibility (EMI/EMC) analysis.

For wireless design, the HFSS and DesignerRF products offer integrated electromagnetic, circuit and system simulation capabilities for designing RF components and comprehensive microwave systems. Additionally, engineers use HFSS and Designer RF to conduct full-wave magnetic field intensity studies on various shielding designs. This helps in ensuring compliance with U.S. and E.U. emission regulations.